Principal PCB &Substrate Layout EngineerApply Now
Location: Phoenix, Arizona
Employment Type: Contract
Job Description
Contract Length: 6 months; onsite position
Job Summary: This person will providing technical leadership to the engineering team specifically focused on High-Speed Interfaces and High Density Substrates layout techniques.
Responsibilities:
Requirements:
Job Summary: This person will providing technical leadership to the engineering team specifically focused on High-Speed Interfaces and High Density Substrates layout techniques.
Responsibilities:
- Driving design, layout, and analysis of complicated electrical and mechanical systems and their constituent parts including: high-density interposers, substrates, and printed circuit board (PCB) layouts. This includes power, digital, analog, and RF signals across multiple die (primarily flip-chip)
- Hands on high-speed, multi-layer packaging, high-density interconnects (HDI), blind and buried vias, ball grid arrays (BGAs), RF, design for test (DFT), impedance calculations, cross talk, differential pairs, PCB stack-ups, PCB via structures, electromagnetic compatibility (EMC), material studies/selection, etc.
- Understand and provide fabrication drawings that match the intent of the design and support the fabrication suppliers to ensure the technical intent is transferred successfully
Requirements:
- Bachelor's Degree in Engineering or equivalent education and experience
- 10+ years as a PCB and/or High-Density Package Layout designer using industry standard layout tools like Cadence APD+
- Experience with APD+ physical and electrical constraint editor
- HDI stack-ups, including use of blind & buried micro-vias, specialty RF dielectric materials, and trace width/spacing around 15um/15um down to 2um/2um or below
- Experience with 2.5D devices, interposer or substrate design, flip-chip, surface mount, die stacking, package stacking, substrate stacking and other techniques
- Experience using a Cadence schematic / netlist driven CAD layout process, e.g. Cadence APD+ (Allegro) and supporting tools
- High-end FPGA package or board design experience
- Must be a US Citizen
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